Failure Modes in Conductive Adhesives
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منابع مشابه
Environmental Aging Effects on the Durability of Electrically Conductive Adhesive Joints
The mechanical behavior of electrically conductive adhesive joints exposed to elevated temperature and relative humidity conditions has been investigated, and failure mechanisms of conductive adhesive joints have been determined. Three model, silver-filled, epoxy-based adhesive systems have been studied in conjunction with printed circuit board (PCB) substrates with metallizations of Au/Ni/Cu a...
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The use of electrically conductive adhesives as interconnection materials in electronic assembly process is increasingly becoming a vital part of the electronics industry. Flip-chip joining technique using conductive adhesives has been identi®ed as a key technology for future electronics assembly and manufacturing. The purpose of the present work is to investigate optimum conditions to achieve ...
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Three Bond has been supplying conductive adhesives for about 15 years. Most of these products take the form of paste containing silver powder. They are used for mounting quartz oscillators and semiconductors. Today, new technologies are developing very rapidly in the electric and electronic industries, creating faster and lighter products, especially in the field of information. Accordingly, el...
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Composites are being used extensively in several engineering applications. However, the efficiency of the joints used in joining composites and metals can be improved. To move towards a sustainable and environment friendly future, natural fibre composite material was used. Towards the above objective, research work was carried out for the assembly between a composite and aluminium. Three differ...
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With the phasing out of lead-bearing solders, electrically conductive adhesives (ECAs) have been identified as one of the environmentally friendly alternatives to tin/lead (Sn/Pb) solders in electronics packaging applications. In particular, with the requirements for fine-pitch and high-performance interconnects in advanced packaging, nanoconductive adhesives are becoming more and more importan...
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تاریخ انتشار 2014